Wafer Thinning Machine Market, Global Outlook and Forecast 2023-2032

The global Wafer Thinning Machine market was valued at US$ 705.2 million in 2022 and is projected to reach US$ 999.7 million by 2029, at a CAGR of 5.1% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Wafer thinning machines, also called grinders, use a centrally located robot to move wafers from the input station to the measurement station. After that, the wafer moves to the polishing station and the cleaning station in sequence. The robot can move the wafer from the cleaning station to the measuring station for measurement after grinding or directly to the output station.

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This report aims to provide a comprehensive presentation of the global market for Wafer Thinning Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Thinning Machine. This report contains market size and forecasts of Wafer Thinning Machine in global, including the following market information:

Global Wafer Thinning Machine Market Revenue, 2018-2023, 2024-2032, ($ millions)

Global Wafer Thinning Machine Market Sales, 2018-2023, 2024-2032, (Units)

Global top five Wafer Thinning Machine companies in 2022 (%)

Global key players of wafer grinder (wafer thinning equipment) include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, etc. Global top three manufacturers hold a share over 84%. Japan is the largest producer of wafer grinder (wafer thinning equipment) holds a share over 57%. In terms of product, full automatic is the largest segment, with a share over 68%. And in terms of application, the largest application is 300 mm wafer, with a share over 78%.

We surveyed the Wafer Thinning Machine manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Wafer Thinning Machine Market, by Type, 2018-2023, 2024-2032 ($ Millions) & (Units)

Global Wafer Thinning Machine Market Segment Percentages, by Type, 2022 (%)

• Edge Thinning

• Surface Thinning

Global Wafer Thinning Machine Market, by Application, 2018-2023, 2024-2032 ($ Millions) & (Units)

Global Wafer Thinning Machine Market Segment Percentages, by Application, 2022 (%)

• Silicon Wafer

• Compound Semiconductors

Global Wafer Thinning Machine Market, By Region and Country, 2018-2023, 2024-2032 ($ Millions) & (Units)

Global Wafer Thinning Machine Market Segment Percentages, By Region and Country, 2022 (%)

• North America

• US

• Canada

• Mexico

• Europe

• Germany

• France

• U.K.

• Italy

• Russia

• Nordic Countries

• Benelux

• Rest of Europe

• Asia

• China

• Japan

• South Korea

• Southeast Asia

• India

• Rest of Asia

• South America

• Brazil

• Argentina

• Rest of South America

• Middle East & Africa

• Turkey

• Israel

• Saudi Arabia

• UAE

• Rest of Middle East & Africa

Competitor Analysis

The report also provides analysis of leading market participants including:

• Key companies Wafer Thinning Machine revenues in global market, 2018-2023 (Estimated), ($ millions)

• Key companies Wafer Thinning Machine revenues share in global market, 2022 (%)

• Key companies Wafer Thinning Machine sales in global market, 2018-2023 (Estimated), (Units)

• Key companies Wafer Thinning Machine sales share in global market, 2022 (%)

Further, the report presents profiles of competitors in the market, key players include:

• ASM Pacific

• Tokyo Seimitsu

• DISCO Corporation

• CETC Beijing Electronic Equipment

• Arnold Gruppe

• Hunan Yujing Machine Industrial

• WAIDA MFG

• GigaMat

• Strasbaugh

• Daitron

• MAT Inc

• Dikema Presicion Machinery

• Dynavest

• Komatsu NTC

Outline of Major Chapters:

Chapter 1: Introduces the definition of Wafer Thinning Machine, market overview.

Chapter 2: Global Wafer Thinning Machine market size in revenue and volume.

Chapter 3: Detailed analysis of Wafer Thinning Machine manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6: Sales of Wafer Thinning Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Global Wafer Thinning Machine capacity by region & country.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 11: The main points and conclusions of the report.

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